x x e e o o n n 3 3 p p o o w w e e r r b b l l u u e e l l e e d d OSB4XNE3E1E ver c.2 features outline dimension highest luminous flux super energy efficiency long lifetime operation superior esd protection superior uv resistance applications read lights (car, bus, aircraft) portable (flashlight, bicycle) bollards / security / garden traffic signaling / beacons in door / out door commercial lights automotive ext unit:mm tolerance:0.30mm esd protection diode anode cathode 3.6 backview absolute maximum rating (ta=25) (ta=25) (ta=25) (ta=25) directivity item symbol value unit dc forward current i f 800 ma pulse forward current* i fp 1000 ma reverse voltage v r 5 v power dissipation p d 3200 mw operating temperature topr -30 ~ +85 storage temperature tstg -40~ +100 lead soldering temperature tsol 260 /5sec - *pulse width max.10ms duty ratio max 1/10 0 0 electrical -optical characteristics (ta=25 (ta=25 (ta=25 (ta=25 ) )) ) forward operating current (dc) item symbol condition min. typ. max. unit i f =350ma 3.0 3.3 4.0 v dc forward voltage v f i f =700ma 3.5 3.8 4.5 v dc reverse current i r v r =5v - - 10 a domi. wavelength d i f =700ma 455 460 465 nm luminous flux v i f =700ma 25 35 - lm 50% power angle 2 1/2 i f =700ma - 140 - deg 0 0 25 50 75 125 ambient temperature, t a ( ) forward current, i f (ma) 100 100 200 300 400 500 600 700 800 r j-a =30 /w r j-a =25 /w r j-a =20 /w r j-a =15 /w note: don?t drive at rated current more than 5s wit hout heat sink for xeon 3 emitter series. led & application technologies
x x e e o o n n 3 3 p p o o w w e e r r b b l l u u e e l l e e d d OSB4XNE3E1E ver c.2 soldering heat reliability (dip): reflow soldering profile reflow soldering should not be done more than two times. when soldering, do not put stress on the leds dur ing heating. after soldering, do not warp the circuit board. repairing should not be done after the leds have been soldered. when repairing is unavoidable, a double-head soldering iron should be used. it sho uld be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing. solder average ramp-up rate = 3oc/sec. max. preheat temperature: 150o~180oc preheat time = 120 sec. max. ramp-down rate = 6oc/sec. max. peak temperature = 220oc max. time within 3oc of actual peak temperature = 25 sec. max. duration above 200oc is 40 sec. max. led & application technologies
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